Output list
Journal article
The phase change problem in materials with internal heat generation in a cylinder
Published 12/2024
International Communications in Heat and Mass Transfer, 159, Part C, 108150
We analyze the evolution of the solid-liquid front during melting and solidification in materials with constant internal heat generation, under prescribed temperature and heat flux conditions at the boundary of an infinite cylinder. We employ a sharp interface approach and assume that the motion of the front is slow relative to the temperature changes in both phases of the material. We derive infinite series solutions for the temperature in each phase and a nonlinear first-order differential equation for the evolution of the interface. Additionally, we solve the problem using the catching of the front into a node method and the Ansys Fluent enthalpy-porosity method. The latter incorporates a mushy zone that is a mixed solid-liquid transition zone. All three methods provide consistent results, especially when the mushy zone is taken into account. The series and front catching solutions develop a finite time overheated zone during melting, whereas the enthalpy solutions do not exhibit this phenomenon. We show that the evolution of the overheated and mushy zones is very similar in shape and time for both boundary conditions.
Journal article
The Stefan Problem With Internal Heat Generation in Spherical Coordinates
Published 09/01/2022
Journal of heat transfer, 144, 9, 092401
A weakly time-dependent equation for the evolution of the solid–liquid interface in spherical coordinates, driven by internal heat generation, is derived for constant surface temperature boundary conditions. The derivation comes by making an assumption that the interface moves slowly compared to the changes in the temperature so that the technique of separation of variables may be applied for Stefan numbers less than one. Under this approximation, we can separate the nonhomogeneous heat diffusion equation into transient and steady-state terms, and then integrate to get the temperature relations. With the temperature equations in hand, the derivatives are inserted into the interface equation giving a first-order differential equation for the location of the solid–liquid interface as a function of time. The results are compared to a previously derived quasi-static solution and a numerical simulation generated using the method of catching of the front. This method allows for direct tracking of a moving boundary via the calculation of the time it takes to move from node to node in a discretized grid characteristic of classical finite difference methods. Plots of the interface evolution show excellent agreement between the three methods, especially for lower Stefan numbers. The quality of the approximation decreases as the Stefan number increases, but the model is more accurate than the previously studied quasi-static model. For the Stefan numbers St = 1.0 and 10.0, the weakly time-dependent solutions are in better agreement with the numerical results than the quasi-static solutions.
Journal article
Kinetic equation for spatially averaged molecular dynamics
Published 2022
Applicable Analysis, 101, 11, 4014 - 4024
Journal article
On artifacts in limited data spherical Radon transform: curved observation surface
Published 2016
Inverse Problems, 31, 1
Journal article
Published 2015
SIAM Journal on Applied Mathematics, 75, 1, 92 - 113
Journal article
Published 2015
IEEE Transactions on Components Packaging and Manufacturing Technology, 5, 7, 991 - 1005
Journal article
A Creep Damage Model for High-Temperature Deformation and Failure of 9Cr-1Mo Steel Weldments
Published 2015
Metals, 5, 3, 1487 - 1506
Journal article
Optimizing performance of the deconvolution model reduction for large ODE systems
Published 2015
IMA Journal of Applied Mathematics, 80, 4, 1099 - 1123
Journal article
Published 2015
Electronics, 4, 4, 799 - 826
Journal article
Causality verification using polynomial periodic continuations for electrical interconnects
Published 2014
Journal of Microelectronics and Electronic Packaging, 11, 43