Signal and power integrity challenges for high density system-on-package

Journal article

Semiconductor Science and Information Devices, Vol.4(2), pp.1-9

2022

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Title: Signal and power integrity challenges for high density system-on-package
Creators: Feng Li
Publication Details: Semiconductor Science and Information Devices, Vol.4(2), pp.1-9
Identifiers: 996629894501851
Academic Unit: Electrical and Computer Engineering
Language: English
Resource Type: Journal article