Interfacial Thermal Resistance and Temperature Dependence of Three Adhesives for Electronic Packaging

Journal article

Fred Barlow, Didericus P H Hasselman, Kimberly Y Donaldson, Aicha Elshabini, Gerhard H Schiroky, Josh P Yaskoff and Raymond L Dietz

IEEE Transactions on Components and Packaging Technologies, Vol.23(4), pp.633-637

2000

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https://doi.org/10.1109/6144.888846View

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Title: Interfacial Thermal Resistance and Temperature Dependence of Three Adhesives for Electronic Packaging
Creators: Fred Barlow
Didericus P H Hasselman
Kimberly Y Donaldson
Aicha Elshabini - University of Arkansas at Fayetteville
Gerhard H Schiroky - University of Arkansas at Fayetteville
Josh P Yaskoff - Virginia Tech
Raymond L Dietz - Virginia Tech
Publication Details: IEEE Transactions on Components and Packaging Technologies, Vol.23(4), pp.633-637
Identifiers: 996631142801851
Academic Unit: University of Idaho
Language: English
Resource Type: Journal article