Flip chip die-to-wafer bonding review: gaps to high volume manufacturing

Journal article

Semiconductor Science and Information Devices, Vol.4(1), pp.8-13

2022

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Title: Flip chip die-to-wafer bonding review: gaps to high volume manufacturing
Creators: Feng Li
Publication Details: Semiconductor Science and Information Devices, Vol.4(1), pp.8-13
Identifiers: 996631237701851
Academic Unit: Electrical and Computer Engineering
Language: English
Resource Type: Journal article