Fabrication of Micro Vias for LTCC Substrates

Journal article

Gangqiang Wang, Erica C Folk, Fred Barlow and Aicha Elshabini

IEEE Transactions on Electronics Packaging Manufacturing, Vol.29(1), pp.32-41

2006

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https://doi.org/10.1109/TEPM.2005.862633View

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Title: Fabrication of Micro Vias for LTCC Substrates
Creators: Gangqiang Wang - University of Arkansas at Fayetteville
Erica C Folk - University of Arkansas at Fayetteville
Fred Barlow - University of Arkansas at Fayetteville
Aicha Elshabini - University of Arkansas at Fayetteville
Publication Details: IEEE Transactions on Electronics Packaging Manufacturing, Vol.29(1), pp.32-41
Identifiers: 996631052401851
Academic Unit: University of Idaho
Language: English
Resource Type: Journal article