Creep deformation behavior of Sn-Zn solder alloys

Journal article

Peer reviewed

Indrajit Charit, Srikant Gollapudi, Korukonda Linga Murty and Triratna Shrestha

Journal of Materials Science, Vol.49(5), pp.2127-2135

2014

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http://dx.doi.org/10.1007/s10853-013-7905-5View

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Title: Creep deformation behavior of Sn-Zn solder alloys
Creators: Indrajit Charit - University of Idaho
Srikant Gollapudi - North Carolina State University
Korukonda Linga Murty - North Carolina State University
Triratna Shrestha - University of Idaho
Publication Details: Journal of Materials Science, Vol.49(5), pp.2127-2135
Identifiers: 996632187901851
Academic Unit: Nuclear Engineering and Industrial Management
Language: English
Resource Type: Journal article