An Overview to Integrated Power Module (IPM) Design for High Power Electronics Packaging

Journal article

Fred Barlow, Alexander B Lostetter and Aicha Elshabini

Microelectronics Reliability Journal, Vol.40, pp.365-379

2000

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Title: An Overview to Integrated Power Module (IPM) Design for High Power Electronics Packaging
Creators: Fred Barlow
Alexander B Lostetter
Aicha Elshabini
Publication Details: Microelectronics Reliability Journal, Vol.40, pp.365-379
Identifiers: 996631557601851
Academic Unit: University of Idaho
Language: English
Resource Type: Journal article