A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations

Journal article

Fred Barlow, Ahmed Abdelnaby, Gabriel Potirniche, Aicha Elshabini and Randy Spreen Parker

Journal of Microelectronics and Electronic Packaging, Vol.8(4), pp.146-153

2011

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https://doi.org/10.4071/imaps.298View

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Title: A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations
Creators: Fred Barlow
Ahmed Abdelnaby
Gabriel Potirniche
Aicha Elshabini
Randy Spreen Parker
Publication Details: Journal of Microelectronics and Electronic Packaging, Vol.8(4), pp.146-153
Identifiers: 996631733101851
Academic Unit: Mechanical Engineering; Institute for Modeling Collaboration and Innovation
Language: English
Resource Type: Journal article