An Open-Circuit Voltage Pixel for Low-Light Visible Imaging in a Standard CMOS Process

Roman Fragasse; Ramy Tantawy; Shane Smith; Suat Ay; Waleed Khalil; IEEE

doi:10.1109/PRIME55000.2022.9816820

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An Open-Circuit Voltage Pixel for Low-Light Visible Imaging in a Standard CMOS Process

Roman Fragasse, Ramy Tantawy, Shane Smith, Suat Ay, Waleed Khalil and IEEE

2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), pp.289-292

06/12/2022

DOI: https://doi.org/10.1109/PRIME55000.2022.9816820

Abstract

Adaptation models

CMOS process

Imaging

NIR

open-circuit

Predictive models

Semiconductor device modeling

Sensitivity

subthreshold

visible

Voc

VocP

Voltage

An imaging pixel unit-cell topology leveraging a photodiode in the forward-bias region is proposed for the visible and near-infrared spectral ranges. The open-circuit voltage pixel (VocP) architecture applied to visible imaging allows for improvement in the effective responsivity of the photodetector, leading to significant enhancement in pixel sensitivity across a wide spectral-range, while relaxing the requirements on the photodiode, and chosen CMOS process. Theoretical analysis is presented to show the operation, response, and performance benefits of the VocP. The pixel topology has been verified in simulation in a 0.13 μm standard CMOS technology, and has also been embedded in an end-to-end readout system model to show the projected performance compared against a conventional 4T-APS.

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Details

Title: An Open-Circuit Voltage Pixel for Low-Light Visible Imaging in a Standard CMOS Process
Creators: Roman Fragasse - The Ohio State University
Ramy Tantawy - SenseICs Corporation,Columbus,OH,43212
Shane Smith - The Ohio State University
Suat Ay - University of Idaho
Waleed Khalil - The Ohio State University
IEEE
Publication Details: 2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME), pp.289-292
Publisher: IEEE
Identifiers: 996651606101851
Academic Unit: Center for Traffic Operations and Control; Electrical and Computer Engineering
Language: English
Resource Type: Conference proceeding