Wirebonding Based 3-D SiC IC Stacks for High Temperature Applications

Conference paper

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

2022

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Title: Wirebonding Based 3-D SiC IC Stacks for High Temperature Applications
Creators: Feng Li
Conference: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Identifiers: 996631461901851
Academic Unit: Electrical and Computer Engineering
Language: English
Resource Type: Conference paper