Technology review of system in package

Conference paper

Technology review of system in package

Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT

2017

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Title: Technology review of system in package
Creators: Feng Li
Conference: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT
Identifiers: 996631231801851
Academic Unit: Electrical and Computer Engineering
Language: English
Resource Type: Conference paper