Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses

Conference paper

Fred Barlow, Ahmed Abdelnaby, Gabriel Potirniche, Aicha Elshabini, Steve Groothuis and Randy Spreen Parker

2013 IEEE Workshop on Microelectronics and Electron Devices (WMED) (Boise, Idaho)

2013

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Title: Numerical Simulation of Silicon Wafer Warpage Due to Thin Film Residual Stresses
Creators: Fred Barlow - University of Idaho
Ahmed Abdelnaby - University of Idaho
Gabriel Potirniche - University of Idaho
Aicha Elshabini - University of Idaho
Steve Groothuis - Micron
Randy Spreen Parker - Micron
Conference: 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED) (Boise, Idaho)
Identifiers: 996632203101851
Academic Unit: Mechanical Engineering; Institute for Modeling Collaboration and Innovation
Language: English
Resource Type: Conference paper