Microbump Processing for 3D IC Integration

Conference paper

Microbump Processing for 3D IC Integration

Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT

2019

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Title: Microbump Processing for 3D IC Integration
Creators: Feng Li
Conference: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT
Identifiers: 996631675801851
Academic Unit: Electrical and Computer Engineering
Language: English
Resource Type: Conference paper