Metal-to-Metal Flip-Chip Bonding for High-Temperature 3D SiC IC Integration and Packaging

Conference paper

2023 IEEE Workshop on Microelectronics and Electron Devices (WMED)

2023

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Title: Metal-to-Metal Flip-Chip Bonding for High-Temperature 3D SiC IC Integration and Packaging
Creators: Feng Li
Conference: 2023 IEEE Workshop on Microelectronics and Electron Devices (WMED)
Identifiers: 996630626301851
Academic Unit: Electrical and Computer Engineering
Language: English
Resource Type: Conference paper